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(Seoul=NSP News Agency) hYUNJIN KIM Journalist = Samsung Electronics developed “H-Cube (Hybrid-Substrate Cube),” the 2.5D packaging solution for high-performance semiconductors and expanded supply of high-performance semiconductors through technical innovation in semiconductor packaging.

The company reserved the H-Cube with available six or more HBM, the highest level in the industry, followed by the existing 2.5 packaging solution I-Cube.

H-Cube is a 2.5D packaging solution with logic chips, including CPU and GPU or HBM on a silicon interposer, targeting HPC, data center, and high-performance semiconductor for networks.

Its two-tier hybrid structure is combined with the main substrate, which is helpful for realizing high performance and the additional substrate, which can implement in large areas and under the main substrate. Thus, it is available for integrating six or more HBM and logic chips.

The company also applied chip analysis technology to the application to provide stable power and to minimize signal loss or distortion while stacking numerous logic chips and HBM, enhancing the solution’s reliability.

NSP News Agency hYUNJIN KIM Journalist kimhj30310@nspna.com
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